BS EN 60384-21:2012
$167.15
Fixed capacitors for use in electronic equipment – Sectional specification. Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
| Published By | Publication Date | Number of Pages |
| BSI | 2012 | 44 |
IEC 60384-21:2011 is applicable to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 1, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits. Capacitors for electromagnetic interference suppression are not included, but are covered by IEC 60384-14. This second edition cancels and replaces the first edition published in 2004 and contains the following significant technical changes with respect to the previous edition: – The test voltage of 1,2 U R at U R greater or equal to 1 000 V has been added in 4.5.4 Voltage proof. – Detail test conditions have been added in 4.7 Shear test and 4.8 Substrate bending test. – Test conditions applying lead free solder alloy (Sn-Ag-Cu) have been included in 4.9 Resistance to soldering heat and 4.10 Solderability. – A selection of the test conditions according to marketing needs have been stated in 4.13 Damp heat, steady state. – The dimensions of 0402 M in Annex A have been added. – The code of the temperature coefficient and the tolerance of capacitance for the reference temperature of 25 °C have been added, see Annex B.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 9 | 1 General 1.1 Scope 1.2 Object 1.3 Normative references 1.4 Information to be given in a detail specification |
| 11 | 1.5 Terms and definitions |
| 12 | 1.6 Marking 2 Preferred ratings and characteristics 2.1 Preferred characteristics |
| 13 | 2.2 Preferred values of ratings Tables Table 1 – Preferred tolerance on nominal capacitance |
| 14 | Table 2 – Nominal temperature coefficient and tolerance |
| 15 | Table 3 – Combination of temperature coefficient and tolerance |
| 16 | 3 Quality assessment procedures 3.1 Primary stage of manufacture 3.2 Structurally similar components 3.3 Certified records of released lots 3.4 Qualification approval |
| 18 | Table 4 – Fixed sample size test plan for qualification approval – Assessment level EZ |
| 19 | Table 5 – Tests schedule for qualification approval |
| 21 | 3.5 Quality conformance inspection |
| 23 | 4 Test and measurement procedures 4.1 Preliminary drying Table 6a – Lot-by-lot inspection Table 6b – Periodic tests |
| 24 | 4.2 Measuring conditions 4.3 Mounting 4.4 Visual examination and check of dimensions Figures Figure 1 – Fault: crack or fissure Figure 2 – Fault: crack or fissure |
| 25 | Figure 3 – Separation or delamination Figure 4 – Exposed electrodes Figure 5 – Principal faces |
| 26 | 4.5 Electrical tests Table 7 – Tangent of loss angle limits |
| 28 | 4.6 Temperature coefficient (α) and temperature cycle drift 4.7 Shear test Table 8 – Test voltages Table 9 – Temperature cyclic drift limits |
| 29 | 4.8 Substrate bending test 4.9 Resistance to soldering heat |
| 30 | Figure 6 – Reflow temperature profile Table 10 – Reflow temperature profiles for Sn-Ag-Cu alloy |
| 31 | 4.10 Solderability Table 11 – Maximum capacitance change |
| 32 | 4.11 Rapid change of temperature |
| 33 | 4.12 Climatic sequence Table 12 – Maximum capacitance change Table 13 – Number of damp heat cycles |
| 34 | 4.13 Damp heat, steady state Table 14 – Final inspection measurements and requirements Table 15 – Test conditions for damp heat, steady state |
| 35 | 4.14 Endurance Table 16 – Final inspection measurements and requirements Table 17 – Endurance test conditions (UC = UR) |
| 36 | 4.15 Robustness of terminations (only for capacitors with strip termination) Table 18 – Endurance test conditions (UC ( UR) Table 19 – Final inspection measurements and requirements |
| 37 | 4.16 Component solvent resistance (if required) 4.17 Solvent resistance of the marking (if required) 4.18 Accelerated damp heat, steady state (if required) Table 20 – Initial requirements Table 21 – Conditioning |
| 39 | Annex A (normative) Guidance for the specification and coding of dimensions of fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 Figure A.1 – Dimensions Table A.1 – Dimensions |
| 40 | Annex B (informative) Combination of temperature coefficient and tolerance for the reference temperature of 25 °C Table B.1 – Combination of temperature coefficient and tolerancefor the reference temperature of 25 °C |
| 41 | Bibliography |
