BS EN 62132-1:2016
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Integrated circuits. Measurement of electromagnetic immunity – General conditions and definitions
| Published By | Publication Date | Number of Pages |
| BSI | 2016 | 30 |
IEC 62132-1:2015 provides general information and definitions about measurement of electromagnetic immunity of integrated circuits (ICs) to conducted and radiated disturbances. It also defines general test conditions, test equipment and setup, as well as the test procedures and content of the test reports for all parts of the IEC 62132 series. Test method comparison tables are included in Annex A to assist in selecting the appropriate measurement method(s). This edition includes the following significant technical changes with respect to the previous edition: a) frequency range of 150 kHz to 1 GHz has been deleted from the title; b) frequency step above 1 GHz has been added in Table 2 in 7.4.1; c) IC performance classes in 8.3 have been modified; d) Table A.1 was divided into two tables, and references to IEC 62132-8 and IEC 62132-9 have been added in the new Table A.2 in Annex A.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 6 | English CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references 3 Terms and definitions |
| 15 | 4 Test conditions 4.1 General 4.2 Ambient conditions 4.2.1 Ambient temperature 4.2.2 RF ambient 4.2.3 RF-immunity of the test setup 4.2.4 Other ambient conditions 4.3 Test generator 4.4 Frequency range |
| 16 | 5 Test equipment 5.1 General 5.2 Shielding 5.3 Test generator and power amplifier 5.4 Other components 6 Test setup 6.1 General 6.2 Test circuit board 6.3 Pin selection scheme |
| 17 | 6.4 IC pin loading/termination 6.5 Power supply requirements 6.6 IC specific considerations 6.6.1 IC supply voltage Tables Table 1 – IC pin loading default values |
| 18 | 6.6.2 IC decoupling 6.6.3 Operation of IC 6.6.4 Guidelines for IC stimulation 6.6.5 IC monitoring 6.7 IC stability over time 7 Test procedure 7.1 Monitoring check 7.2 Human exposure 7.3 System verification |
| 19 | 7.4 Specific procedures 7.4.1 Frequency steps 7.4.2 Amplitude modulation 7.4.3 Power levelling for modulation Table 2 – Frequency step size versus frequency range |
| 20 | 7.4.4 Dwell time 7.4.5 Monitoring of the IC 8 Test report 8.1 General Figure 1 – RF signal when RF peak power level is maintained |
| 21 | 8.2 Immunity limits or levels 8.3 IC performance classes 8.4 Interpretation of results 8.4.1 Comparison between IC(s) using the same test method 8.4.2 Comparison between different test methods 8.4.3 Correlation to module test methods |
| 22 | Annex A (informative) Test method comparison table Table A.1 – Conducted immunity |
| 23 | Table A.2 – Radiated immunity |
| 24 | Annex B (informative) General test board description B.1 Overview B.2 Board description – Mechanical B.3 Board description – Electrical B.3.1 General B.3.2 Ground planes Table B.1 – Position of vias over the board |
| 25 | B.3.3 Package pins B.3.4 Via diameters B.3.5 Via distance B.3.6 Additional components B.3.7 Supply decoupling |
| 26 | B.3.8 I/O load |
| 27 | Figure B.1 – Example of an immunity test board |
| 28 | Bibliography |
