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BS IEC 60115-4-10:2023:2024 Edition

BS IEC 60115-4-10:2023:2024 Edition

$189.07

Fixed resistors for use in electronic equipment – Blank detail specification: Power resistors with axial leads for through-hole assembly on circuit boards (THT), for general electronic equipment, classification level G

Published By Publication Date Number of Pages
BSI 2024 50
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
7 FOREWORD
9 0 Introduction to the template provided by this blank detail specification
0.1 Scope of this blank detail specification
0.2 Function of this blank detail specification
10 0.3 Identification of the detail specification and the resistor
12 1 Scope
2 Normative references
13 3 Terms and definitions
4 Characteristics and ratings
4.1 General
4.2 Dimensions
14 Figures
Figure 1 – Outline and dimensions
Tables
Table 1 – Styles and dimensions
15 4.3 Ratings
Figure 2 – Lead eccentricity of the wire terminations
Figure 3 – Length of excessive coating on the wire terminations
16 Table 2 – Climatic categories
Table 3 – Ratings
17 4.4 Resistance range and tolerance on resistance
Figure 4 – Derating curve for power resistors
18 5 Tests and test severities
5.1 General
5.2 Resistance
Table 4 – Temperature coefficients, tolerances and resistance rangesfor climatic category … / … / …
19 5.3 Temperature coefficient of resistance
5.4 Temperature rise
5.5 Endurance at the rated temperature 70 °C
5.6 Endurance at other than rated temperature
5.6.1 Endurance at room temperature
5.6.2 Endurance at a maximum temperature: UCT with category dissipation
5.7 Short-term overload of power resistors
5.7.1 Power film resistors
20 5.7.2 Wirewound resistors
5.8 Electrostatic discharge (ESD) test
5.9 Visual examination
Table 5 – Short-term overload duration
Table 6 – ESD test voltages
21 5.10 Gauging of dimensions
5.11 Detail dimensions
5.12 Robustness
5.12.1 Robustness of terminations
5.12.2 Robustness of the resistor body
5.13 Shock and vibration
5.13.1 Vibration
5.13.2 Shock or bump
5.14 Rapid change of temperature
22 5.15 Climatic sequence
5.16 Damp heat, steady state test
Table 7 – Additional cycles of the damp heat, cyclic test
Table 8 – Damp heat, steady state test duration
23 5.17 Solderability, with lead-free solder
5.18 Solderability, with SnPb solder
5.19 Resistance to soldering heat
5.20 Solvent resistance test
24 5.21 Insulation resistance
5.22 Voltage proof
5.23 Flammability test
6 Performance requirements
6.1 General
6.2 Limits for change of resistance at tests
25 6.3 Temperature coefficient of resistance
Table 9 – Limits for change of resistance at tests
26 6.4 Temperature rise
6.5 Visual examination
6.5.1 General visual criteria
Table 10 – Permitted change of resistance due to the variation of temperature
27 6.5.2 Visual criteria after tests
6.5.3 Visual criteria for packaging
6.6 Solderability
6.7 Insulation resistance
28 6.8 Flammability
7 Marking, packaging and ordering information
7.1 Marking of the component
7.2 Packaging
7.3 Marking of the packaging
7.4 Ordering information
29 8 Additional information
8.1 General
8.2 Storage and Transportation
8.3 Substrate for assembly
8.4 Soldering process
8.5 Use of cleaning agents or solvents
30 8.6 Coating or potting after assembly
9 Quality assessment procedures
9.1 General
9.1.1 100 % test
9.1.2 Certificate of Conformity (CoC)
31 9.1.3 Certified test records of released lots
9.2 Qualification approval
9.3 Maintenance of a qualification approval
9.3.1 Quality conformance inspection
9.3.2 Non-conforming specimen
32 Table 11 – Test schedule for the qualification approval of power resistors(1 of 5)
37 Table 12 – Test schedule for quality conformance inspection of power resistors(1 of 5)
43 Annex A (normative)Symbols and abbreviated terms
A.1 Symbols
45 A.2 Abbreviated terms
46 Annex B (normative)Reference for visual examination
47 Annex X (informative)Cross-reference for references to the prior revision of this specification
Table X.1 – Cross reference for references to clauses
48 Bibliography

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BS IEC 60115-4-10:2023
$189.07