BS ISO 16525-1:2014
$102.76
Adhesives. Test methods for isotropic electrically conductive adhesives – General test methods
Published By | Publication Date | Number of Pages |
BSI | 2014 | 16 |
This part of ISO 16525 specifies general test methods for isotropic electrically conductive adhesives used in wiring, die attach of semiconductors, and surface assembly of printed circuit boards.
This part of ISO 16525 does not specify the materials and the performance of the isotropic electrically conductive adhesives. This part of ISO 16525 does not specify the performance of the test pieces bonded by using the adhesive concerned.
PDF Catalog
PDF Pages | PDF Title |
---|---|
6 | Foreword |
7 | Section sec_1 Section sec_2 1 Scope 2 Normative references |
8 | Section sec_3 Section sec_3.1 Section sec_3.2 Section sec_4 Section sec_4.1 Section sec_4.2 Section sec_4.3 3 Terms and definitions 4 Lists of test requirements 4.1 Tests for properties before curing 4.2 Tests for conditions of use 4.3 Tests for properties after curing |
9 | Section sec_5 Section sec_5.1 Section sec_5.2 Section sec_5.3 Section sec_5.4 Section sec_6 Section sec_6.1 Section sec_6.2 Section sec_6.3 Section sec_7 Section sec_8 Section sec_8.1 Section sec_8.2 5 Test conditions and sampling 5.1 Atmospheric conditions 5.2 Conditioning of the specimens 5.3 Definition of lot 5.4 Sampling 6 Tests for properties before curing/drying 6.1 Appearance 6.2 Density 6.3 Viscosity 7 Tests for conditions of use — Pot life 8 Test for properties after curing 8.1 Glass transition temperature, Tg 8.2 Moisture absorption ratio |
10 | Section sec_8.2.1 Section sec_8.2.1.1 Section sec_8.2.1.2 Section sec_8.2.1.3 Section sec_8.2.1.4 Section sec_8.2.2 Section sec_8.2.3 Section sec_8.3 Section sec_8.4 Section sec_8.5 8.3 Modulus of elasticity 8.4 Surface hardness 8.5 Thermal expansion |
11 | Section sec_8.6 Section sec_9 8.6 Moisture permeability 9 Test report |
12 | Reference ref_1 Reference ref_2 Reference ref_3 Reference ref_4 Reference ref_5 Reference ref_6 Bibliography |