BSI DD IEC/TS 62454:2007

$102.76

Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series

Published By	Publication Date	Number of Pages
BSI	2007	22

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Description

Provides interface dimensions and cooling performance guidelines for cabinets, using water supplied heat exchangers. Is applicable to cabinets in accordance with the IEC 60297 (19 in) and IEC 60917 (25 mm) series.

Additional information

Status	Definitive
Pages	22
Publication Date	2007-11-30
ISBN	978 0 580 57032 2
Standard Number	DD IEC/TS 62454:2007
Title	Mechanical structures for electronic equipment. Design guide. Interface dimensions and provisions for water cooling of electronic equipment within cabinets of the IEC 60297 and IEC 60917 series
Identical National Standard Of	IEC/TS 62454:2007
Descriptors	Heat transfer, Printed-circuit boards, Racks, Dimensions, Mathematical calculations, Cooling systems, Air, Cooling, Interfaces, Storage equipment, Heat exchangers, Electric enclosures, Electronic equipment and components, Water-cooled systems
Publisher	BSI
Committee	EPL/48
ICS Codes	31.240 - Mechanical structures for electronic equipment

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BSI DD IEC/TS 62454:2007

$102.76


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