BSI PD IEC/TS 62861:2017
$198.66
Guidelines for principal component reliability testing for LED light sources and LED luminaires
| Published By | Publication Date | Number of Pages |
| BSI | 2017 | 70 |
This Technical Specification provides guidelines for establishing confidence in product reliability using principal component testing for LED light sources and LED luminaires for general lighting. It includes methods and criteria using initial qualification tests and accelerated stress tests of the principal components. The performance of any principal component will influence the performance of the final product.
Techniques to validate full lifetime claims and lumen maintenance projection are outside the scope of this Technical Specification.
The following principal components are included in the testing if they are used as an integral part for the LED light source or LED luminaire:
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LED package and interconnects;
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optical materials;
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electronic subassemblies;
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cooling systems, both active (e.g. fans) and passive (e.g. thermal interface material);
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construction materials.
This Technical Specification is not recommended for use as a normative reference to the LED product performance standards.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 8 | FOREWORD |
| 10 | INTRODUCTION |
| 11 | 1 Scope 2 Normative references |
| 12 | 3 Terms and definitions |
| 15 | 4 Component test conditions |
| 16 | 5 LED package and interconnects 5.1 General 5.2 Sampling requirements 5.3 Production requirements |
| 17 | 5.4 Assembly of LED packages on test boards 5.5 Moisture preconditioning 5.6 Thermal characteristics 5.7 Pre- and post-stress electrical and photometric requirements 5.8 Pre- and post-stress visual inspection 5.9 Solderability and resistance to soldering heat 5.9.1 Solderability 5.9.2 Resistance to soldering heat (RSH-reflow) test |
| 18 | 5.10 Failure criteria 5.11 Initial qualification tests for LED packages 5.11.1 General |
| 19 | 5.11.2 Temperature and operation stress |
| 20 | 5.11.3 Thermo-mechanical stress 5.11.4 Temperature and humidity stress |
| 21 | 5.11.5 Electrical stress – ESD-HBM 5.11.6 Environmental stress |
| 22 | 5.12 Initial qualification test for LED package interconnects – VVF 5.13 Accelerated stress tests for LED package interconnects 5.13.1 General Tables Table 1 – Mapping the LED package interconnects qualification tests to the useable acceleration model with typical range of the acceleration factor |
| 23 | 5.13.2 Interconnect temperature cycling (TMCL) 6 Optical materials 6.1 General Table 2 – Duration (cycles) of temperature application |
| 24 | 6.2 Optical material test samples 6.3 Moisture preconditioning 6.4 Pre- and post-stress photometric measurements |
| 25 | 6.5 Adhesion test 6.6 Pre- and post-stress visual inspection 6.7 Failure criteria 6.8 Initial qualification tests 6.8.1 Relative humidity (RH) |
| 26 | 6.8.2 Boiling water (BW) 6.8.3 Oven water (OW) 6.8.4 High temperature exposure (HTE) 6.9 Accelerated stress tests 6.9.1 Prediction models Table 3 – Mapping of the optical-material related accelerated stress tests |
| 27 | 6.9.2 Temperature and humidity (TH) 6.9.3 Temperature and light exposure (TL) |
| 28 | 6.10 Light-transmitting materials 6.11 Light-reflecting materials 6.11.1 Dichroic-coated glass and aluminium-coated glass 6.11.2 Aluminium-coated plastic 6.11.3 White plastic/non-coated plastic |
| 29 | 6.12 Optical converters 7 Electronic subassemblies 7.1 General 7.2 Sampling requirements 7.3 Production requirements |
| 30 | 7.4 Pre- and post-stress electrical requirements 7.5 Pre- and post-stress visual inspection 7.6 Failure criteria 7.7 Initial qualification tests 7.7.1 Temperature and operation stress (PTC) |
| 31 | 7.7.2 Humidity and operation stress (HOT) 7.8 Accelerated stress tests 7.8.1 Prediction models 7.8.2 Temperature, humidity and operation stress (sequential ALT) Table 4 – Mapping the electronic subassembly qualification tests to the useable acceleration model with typical range of the acceleration factor |
| 32 | 8 Active and passive cooling systems 8.1 General Table 5 – Example ALT profile for an electronic subassembly |
| 33 | 8.2 Cooling system test samples Table 6 – Examples of stressors, affected part of the cooling systems and its reliability effect. |
| 34 | 8.3 Moisture preconditioning 8.4 Thermal resistance test 8.5 Performance parameter test 8.6 Pre- and post-stress cooling performance requirements 8.7 Pre- and post-stress visual inspection 8.8 Failure criteria |
| 35 | 8.9 Initial qualification tests 8.9.1 General 8.9.2 Dust |
| 36 | 8.10 Accelerated stress tests 8.10.1 General 8.10.2 Cyclic temperature test (CT) with humidity and with/without operational stress 8.10.3 Temperature life test (TLT) passive cooling system Table 7 – Mapping the cooling system qualification tests to the useable acceleration model with typical range of the acceleration factor |
| 37 | 8.10.4 Temperature life test (TLT) active cooling system 9 Construction materials 9.1 General |
| 38 | 9.2 Mechanical components and interconnects 9.3 Mechanical interfaces between different components |
| 39 | 9.4 Chemical interactions |
| 40 | 10 Final product testing 10.1 General 10.2 Principal component reliability in the final product Table 8 – List of undesired chemicals in LED products for general lighting. |
| 41 | 10.3 Minimum validated AST time Table 9 – Influence of the principal components on the final product. |
| 42 | 10.4 Final product qualification for reliability 11 Product updates Table 10 – Example list of validated AST times. |
| 43 | Table 11 – Minor and major change list per principal component. |
| 44 | Annex A (informative)Application profiles Table A.1 – Example of two application profiles |
| 45 | Annex B (informative)Acceleration models B.1 General B.2 Arrhenius model |
| 46 | B.3 Eyring model B.4 Coffin-Manson model B.5 Norris-Landzberg model |
| 47 | B.6 (Inverse) power law B.7 Peck model B.8 Generalized Eyring model |
| 48 | B.9 Sample size calculation |
| 49 | B.10 Basic guidelines B.11 Example Table B.1 – Sample sizes versus confidence and reliability level assuming L = T × AF |
| 50 | Table B.2 – Example of calculated acceleration factors |
| 51 | Annex C (informative)System reliability C.1 General C.2 Basic principles C.3 Testing on the system level |
| 52 | C.4 System reliability prediction C.4.1 General C.4.2 Block diagrams |
| 53 | C.4.3 Fault tree C.4.4 Markov chains C.4.5 Bayesian networks |
| 54 | C.4.6 Chi-square |
| 55 | Table C.1 – Example test scheme and results for Chi-square. |
| 56 | Annex D (informative)Qualification flowcharts D.1 General D.2 Qualification flowcharts of principal components Figures Figure D.1 – Qualification flowchart for LED package and interconnects |
| 57 | Figure D.2 – Qualification flowchart for optical materials |
| 58 | Figure D.3 – Qualification flowchart for electronic subassemblies |
| 59 | Figure D.4 – Qualification flowchart for active and passive cooling systems |
| 60 | Figure D.5 – Qualification flowchart for construction materials |
| 61 | Annex E (informative)Physical analysis for principal components E.1 General E.2 DPA for LED packages and interconnects |
| 62 | E.3 DPA for optical materials E.4 PA for electronics |
| 63 | E.5 PA for active and passive cooling systems E.6 DPA for mechanical |
| 64 | Annex F (normative)Principal component test report |
| 65 | Table F.1 – Example overview reporting format |
| 66 | Bibliography |
