DIN EN IEC 61189-2-807:2020 Edition

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Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA (Draft)

Published By	Publication Date	Number of Pages
DIN	2020-12	14

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Categories: 31.180 - Printed circuits and boards, 31.190 - Electronic component assemblies, DIN

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Description

This International Standard specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA).

Additional information

Published Code	DIN
Published By	Deutsches Institut für Normung
Publication Date	2020-12
Pages Count	14
Language	Germany
Descriptors	Assemblies, Decomposition, Electrical components, Electrical engineering, Electronic equipment and components, Interconnection, Interconnection structures, Printed circuits, Printed-circuit boards, Temperature, Testing, Deterioration
File Size	962.6 KB
ICS Codes	31.180 - Printed circuits and boards 31.190 - Electronic component assemblies

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DIN EN IEC 61189-2-807:2020 Edition

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