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IEC 60749-30:2020

IEC 60749-30:2020

$22.75

Semiconductor devices – Mechanical and climatic test methods – Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Published By Publication Date Number of Pages
IEC 2020-08-17 30
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IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
– inclusion of new Clause 3;
– expansion of 6.7 on solder reflow;
– inclusion of explanatory notes and clarifications.

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IEC 60749-30:2020
$22.75