IEC 61188-5-6:2003

$43.55

Printed boards and printed board assemblies – Design and use – Part 5-6: Attachment (land/joint) considerations – Chip carriers with J-leads on four sides

Published By	Publication Date	Number of Pages
IEC	2003-01-23	46

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Categories: 31.190 - Electronic component assemblies, IEC

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Description

Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. Provides the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allows for inspection, testing and reworking of resulting solder joints.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2003-01-23
Pages Count	46
Language	France
Edition	1.0
File Size	399.4 KB
ICS Codes	31.190 - Electronic component assemblies

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IEC 61188-5-6:2003

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