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IEC 61190-1-2:2014

$43.55

Matériaux de fixation pour les assemblages électroniques – Partie 1-2 : exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques

Published By Publication Date Number of Pages
IEC 2014-02-19 50
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Published Code

IEC

Published By

International Electrotechnical Commission

Publication Date

2014-02-19

Pages Count

50

Language

France

Edition

3.0

File Size

1.3 MB

ICS Codes 31.190 - Electronic component assemblies
IEC 61190-1-2:2014
$43.55