IEC 61190-1-2:2014
$43.55
Matériaux de fixation pour les assemblages électroniques – Partie 1-2 : exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques
Published By | Publication Date | Number of Pages |
IEC | 2014-02-19 | 50 |
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Published Code | IEC |
---|---|
Published By | International Electrotechnical Commission |
Publication Date | 2014-02-19 |
Pages Count | 50 |
Language | France |
Edition | 3.0 |
File Size | 1.3 MB |
ICS Codes | 31.190 - Electronic component assemblies |
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