IEC 61191-1:2013

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Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Published By	Publication Date	Number of Pages
IEC	2013-05-21	100

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Categories: 31.190 - Electronic component assemblies, 31.240 - Mechanical structures for electronic equipment, IEC

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Description

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
– reference standard IEC 61192-1 has been replaced by IPC-A-610;
– some of the terminology has been updated;
– references to IEC standards have been corrected;
– the use of lead-free alloys in the assembly have been added.

Additional information

Published Code	IEC
Published By	International Electrotechnical Commission
Publication Date	2013-05-21
Pages Count	100
Language	France
Edition	2.0
File Size	1.4 MB
ICS Codes	31.190 - Electronic component assemblies 31.240 - Mechanical structures for electronic equipment

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IEC 61191-1:2013

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