{"id":308521,"date":"2024-10-19T21:10:25","date_gmt":"2024-10-19T21:10:25","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iso-16525-12014\/"},"modified":"2024-10-25T18:48:49","modified_gmt":"2024-10-25T18:48:49","slug":"bs-iso-16525-12014","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iso-16525-12014\/","title":{"rendered":"BS ISO 16525-1:2014"},"content":{"rendered":"
This part of ISO 16525 specifies general test methods for isotropic electrically conductive adhesives used in wiring, die attach of semiconductors, and surface assembly of printed circuit boards.<\/p>\n
This part of ISO 16525 does not specify the materials and the performance of the isotropic electrically conductive adhesives. This part of ISO 16525 does not specify the performance of the test pieces bonded by using the adhesive concerned.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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6<\/td>\n | Foreword <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | Section sec_1 Section sec_2 1\tScope 2\tNormative references <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Section sec_3 Section sec_3.1 Section sec_3.2 Section sec_4 Section sec_4.1 Section sec_4.2 Section sec_4.3 3\tTerms and definitions 4\tLists of test requirements 4.1\tTests for properties before curing 4.2\tTests for conditions of use 4.3\tTests for properties after curing <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | Section sec_5 Section sec_5.1 Section sec_5.2 Section sec_5.3 Section sec_5.4 Section sec_6 Section sec_6.1 Section sec_6.2 Section sec_6.3 Section sec_7 Section sec_8 Section sec_8.1 Section sec_8.2 5\tTest conditions and sampling 5.1\tAtmospheric conditions 5.2\tConditioning of the specimens 5.3\tDefinition of lot 5.4\tSampling 6\tTests for properties before curing\/drying 6.1\tAppearance 6.2\tDensity 6.3\tViscosity 7\tTests for conditions of use \u2014 Pot life 8\tTest for properties after curing 8.1\tGlass transition temperature, Tg 8.2\tMoisture absorption ratio <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Section sec_8.2.1 Section sec_8.2.1.1 Section sec_8.2.1.2 Section sec_8.2.1.3 Section sec_8.2.1.4 Section sec_8.2.2 Section sec_8.2.3 Section sec_8.3 Section sec_8.4 Section sec_8.5 8.3\tModulus of elasticity 8.4\tSurface hardness 8.5\tThermal expansion <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Section sec_8.6 Section sec_9 8.6\tMoisture permeability 9\tTest report <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Reference ref_1 Reference ref_2 Reference ref_3 Reference ref_4 Reference ref_5 Reference ref_6 Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Adhesives. Test methods for isotropic electrically conductive adhesives – General test methods<\/b><\/p>\n |