{"id":418435,"date":"2024-10-20T06:21:00","date_gmt":"2024-10-20T06:21:00","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-16602-70-612022\/"},"modified":"2024-10-26T11:51:09","modified_gmt":"2024-10-26T11:51:09","slug":"bs-en-16602-70-612022","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-16602-70-612022\/","title":{"rendered":"BS EN 16602-70-61:2022"},"content":{"rendered":"

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
23<\/td>\n1 Scope <\/td>\n<\/tr>\n
24<\/td>\n2 Normative references <\/td>\n<\/tr>\n
26<\/td>\n3 Terms, definitions and abbreviated terms
3.1 Terms from other standards
3.2 Terms specific to the present standard <\/td>\n<\/tr>\n
31<\/td>\n3.3 Abbreviated terms <\/td>\n<\/tr>\n
33<\/td>\n3.4 Nomenclature <\/td>\n<\/tr>\n
34<\/td>\n4 Principles of reliable soldered connections <\/td>\n<\/tr>\n
35<\/td>\n5 Preparatory conditions
5.1 Facility cleanliness
5.2 Environmental conditions <\/td>\n<\/tr>\n
36<\/td>\n5.3 Lighting requirements
5.4 Precautions against static discharges
5.4.1 Overview <\/td>\n<\/tr>\n
37<\/td>\n5.4.2 General
5.4.3 ESD Protected Area <\/td>\n<\/tr>\n
38<\/td>\n5.4.4 Precautions against ESD during manufacturing <\/td>\n<\/tr>\n
39<\/td>\n5.4.5 Protective packaging and ESD protection
5.5 Equipment and tools
5.5.1 General <\/td>\n<\/tr>\n
40<\/td>\n5.5.2 Brushes
5.5.3 Cutters and pliers <\/td>\n<\/tr>\n
41<\/td>\n5.5.4 Bending tools
5.5.5 Clinching tools <\/td>\n<\/tr>\n
42<\/td>\n5.5.6 Insulation strippers
5.5.6.1 Thermal strippers
5.5.6.2 Precision mechanical cutting-type strippers <\/td>\n<\/tr>\n
43<\/td>\n5.5.6.3 Enamel stripping for wires
5.5.6.4 Verification of stripping tools
5.5.7 Hot air blower
5.5.8 Soldering tools
5.5.8.1 General
5.5.8.2 Holding tools
5.5.8.3 Thermal shunts <\/td>\n<\/tr>\n
44<\/td>\n5.5.8.4 Anti-wicking tools
5.5.8.5 Soldering irons
5.5.9 Baking and curing ovens <\/td>\n<\/tr>\n
45<\/td>\n5.5.10 Solder deposition equipment
5.5.11 Automatic component placement equipment
5.5.12 Dynamic wave-solder machines <\/td>\n<\/tr>\n
46<\/td>\n5.5.13 Selective wave solder equipment <\/td>\n<\/tr>\n
47<\/td>\n5.5.14 Reflow process equipment
5.5.14.1 Condensation (vapour phase) reflow machines
5.5.14.2 Local hot gas reflow machines <\/td>\n<\/tr>\n
48<\/td>\n5.5.14.3 Forced convection and infrared reflow systems
5.5.14.4 Other equipment for reflow soldering
5.5.14.5 Reflow process control parameters <\/td>\n<\/tr>\n
49<\/td>\n5.5.15 Depanelization tool
5.5.16 Cleanliness testing equipment
5.5.17 Optical microscope
5.5.18 Automatic Optical Inspection (AOI) equipment
5.5.19 X-ray inspection equipment <\/td>\n<\/tr>\n
51<\/td>\n6 Material selection
6.1 General
6.2 Solder
6.2.1 Form <\/td>\n<\/tr>\n
52<\/td>\n6.2.2 Composition <\/td>\n<\/tr>\n
54<\/td>\n6.2.3 Storage and handling of paste purity
6.3 Fluxes
6.3.1 Rosin based fluxes <\/td>\n<\/tr>\n
55<\/td>\n6.4 Solvents <\/td>\n<\/tr>\n
56<\/td>\n6.5 Flexible insulation materials
6.6 Terminals
6.6.1 Materials
6.6.2 Tin, silver, and gold-plated terminals <\/td>\n<\/tr>\n
57<\/td>\n6.7 Wires
6.8 Sculptured flex
6.9 Printed circuits substrates
6.9.1 Substrates selection
6.9.2 Gold finish on PCBs footprint <\/td>\n<\/tr>\n
58<\/td>\n6.9.3 PCB design requirements for wave and selective wave soldering
6.10 Components
6.10.1 General <\/td>\n<\/tr>\n
59<\/td>\n6.10.2 Moisture sensitive components
6.11 Adhesives, potting, underfill and conformal coatings <\/td>\n<\/tr>\n
60<\/td>\n7 Preparations prior to mounting and soldering
7.1 General handling
7.2 Storage
7.2.1 Components
7.2.2 PCBs
7.2.3 Materials requiring segregation <\/td>\n<\/tr>\n
61<\/td>\n7.3 Baking conditions of PCBs
7.4 Baking and storage of moisture sensitive components <\/td>\n<\/tr>\n
62<\/td>\n7.5 Preparation of components, wires, terminals, and solder cups
7.5.1 Damage to insulation
7.5.2 Damage to conductors and braid <\/td>\n<\/tr>\n
63<\/td>\n7.5.3 Cleaning before soldering
7.5.4 Insulation clearance
7.5.5 Wire lay
7.6 Degolding and pretinning
7.6.1 General <\/td>\n<\/tr>\n
64<\/td>\n7.6.2 Solder baths method for degolding and pretinning of components terminations and terminals <\/td>\n<\/tr>\n
66<\/td>\n7.6.3 Solder iron method for degolding and pretinning
7.6.3.1 PCB
7.6.3.2 Components terminations
7.6.3.3 Solder cup
7.6.4 Pretinning processes
7.6.4.1 Pretinning of pure tin finish component leads <\/td>\n<\/tr>\n
67<\/td>\n7.6.4.2 Solder bath method for pretinning of stranded wires
7.6.4.3 Solder iron method for pretinning of wires and braids
7.6.4.4 Requirements for pretinning of wires
7.7 Preparation of the soldering tip <\/td>\n<\/tr>\n
69<\/td>\n8 Components mounting requirements prior to soldering
8.1 General requirements
8.2 Mounting of through hole components
8.2.1 General <\/td>\n<\/tr>\n
70<\/td>\n8.2.2 Heavy components
8.2.3 Metal-case components
8.2.4 Glass-encased components
8.2.5 Stress relief of components with bendable leads <\/td>\n<\/tr>\n
73<\/td>\n8.2.6 Stress relief of components with non-bendable leads <\/td>\n<\/tr>\n
74<\/td>\n8.2.7 Bending of component leads <\/td>\n<\/tr>\n
75<\/td>\n8.2.8 Lead attachment to PCBs
8.2.8.1 General
8.2.8.2 Stud leads <\/td>\n<\/tr>\n
77<\/td>\n8.2.8.3 Clinching of components in non-plated through holes <\/td>\n<\/tr>\n
78<\/td>\n8.2.9 Mounting of through hole connectors to PCBs <\/td>\n<\/tr>\n
79<\/td>\n8.2.10 Mounting of swage terminals to PCBs <\/td>\n<\/tr>\n
80<\/td>\n8.2.11 Mounting of components to terminals <\/td>\n<\/tr>\n
81<\/td>\n8.3 Mounting of surface mount components
8.3.1 General <\/td>\n<\/tr>\n
82<\/td>\n8.3.2 Lead forming
8.3.3 Inspection of solder paste deposition <\/td>\n<\/tr>\n
83<\/td>\n9 Attachment of conductors to terminals, solder cups and cables
9.1 General
9.2 Wire termination
9.2.1 Breakouts from cables <\/td>\n<\/tr>\n
84<\/td>\n9.2.2 Insulation clearance
9.3 Turret and straight-pin terminals <\/td>\n<\/tr>\n
85<\/td>\n9.4 Bifurcated terminals
9.4.1 General
9.4.2 Bottom route <\/td>\n<\/tr>\n
86<\/td>\n9.4.3 Side route <\/td>\n<\/tr>\n
87<\/td>\n9.4.4 Top route <\/td>\n<\/tr>\n
88<\/td>\n9.4.5 Combination of top and bottom routes
9.4.6 Combination of side and bottom routes
9.5 Hook terminals <\/td>\n<\/tr>\n
89<\/td>\n9.6 Pierced terminals
9.7 Solder cups for connector <\/td>\n<\/tr>\n
90<\/td>\n9.8 Insulation sleeving <\/td>\n<\/tr>\n
91<\/td>\n9.9 Wire and cable interconnections
9.9.1 General
9.9.2 Preparation of wires <\/td>\n<\/tr>\n
92<\/td>\n9.9.3 Preparation of shielded wires and cables
9.9.4 Pre-assembly of wires <\/td>\n<\/tr>\n
93<\/td>\n9.10 Connection of wires to PCBs <\/td>\n<\/tr>\n
95<\/td>\n9.11 Connection of coaxial cables to PCBs <\/td>\n<\/tr>\n
96<\/td>\n10 Assembly to terminals and to PCBs
10.1 Overview
10.2 General soldering conditions
10.2.1 General <\/td>\n<\/tr>\n
97<\/td>\n10.2.2 Positioning <\/td>\n<\/tr>\n
98<\/td>\n10.2.3 Application of flux <\/td>\n<\/tr>\n
99<\/td>\n10.2.4 Flux controls for wave-soldering equipment
10.2.5 Soldering temperatures <\/td>\n<\/tr>\n
101<\/td>\n10.2.6 Soldering of conductors in terminals
10.2.6.1 Soldering of conductors onto terminals except cup terminals
10.2.6.2 Soldering of conductors onto cup terminals <\/td>\n<\/tr>\n
102<\/td>\n10.3 Soldering of components, terminals, and wires into PCB through holes
10.3.1 General
10.3.2 Solder fillets for wires and terminations <\/td>\n<\/tr>\n
103<\/td>\n10.3.3 Solder fillets for component leads in plated or non-plated through holes <\/td>\n<\/tr>\n
104<\/td>\n10.4 Soldering of surface mount components
10.4.1 General <\/td>\n<\/tr>\n
106<\/td>\n10.4.2 Rectangular and square end-capped or end-metallized leadless chip <\/td>\n<\/tr>\n
108<\/td>\n10.4.3 Cylindrical and square end-capped components with cylindrical or oval body <\/td>\n<\/tr>\n
109<\/td>\n10.4.4 Bottom terminated chip components <\/td>\n<\/tr>\n
111<\/td>\n10.4.5 L-Shape inwards components <\/td>\n<\/tr>\n
112<\/td>\n10.4.6 Leadless component with plane termination
10.4.7 Leaded component with plane termination <\/td>\n<\/tr>\n
114<\/td>\n10.4.8 Leadless castellated ceramic chip carrier components <\/td>\n<\/tr>\n
115<\/td>\n10.4.9 No lead Quad Flat Pack <\/td>\n<\/tr>\n
117<\/td>\n10.4.10 Flat pack and gull-wing leaded components with round, rectangular, ribbon leads <\/td>\n<\/tr>\n
118<\/td>\n10.4.11 Components with \u201cJ\u201d leads <\/td>\n<\/tr>\n
119<\/td>\n10.4.12 Components with ribbon terminals without stress relief <\/td>\n<\/tr>\n
121<\/td>\n10.4.13 Stacked modules components with leads protruding vertically from bottom <\/td>\n<\/tr>\n
122<\/td>\n10.4.14 Area array devices <\/td>\n<\/tr>\n
124<\/td>\n10.5 Rework and repair
10.5.1 Removal of solder on unpopulated PCB
10.5.2 Rework, repair and modifications <\/td>\n<\/tr>\n
125<\/td>\n10.6 High-voltage connections <\/td>\n<\/tr>\n
127<\/td>\n10.7 Solderless components <\/td>\n<\/tr>\n
128<\/td>\n11 Post soldering process requirements
11.1 Cleaning of PCB assemblies
11.1.1 General <\/td>\n<\/tr>\n
129<\/td>\n11.1.2 Verification of cleanliness
11.1.3 Surface Insulation Resistance (SIR) testing <\/td>\n<\/tr>\n
130<\/td>\n11.1.4 Sodium chloride (NaCl) equivalent ionic contaminants testing <\/td>\n<\/tr>\n
131<\/td>\n11.1.5 Monitoring of cleanliness
11.2 Staking and bonding <\/td>\n<\/tr>\n
132<\/td>\n11.3 Conformal coating, potting and underfill <\/td>\n<\/tr>\n
134<\/td>\n12 Final inspection
12.1 General
12.2 Visual acceptance criteria <\/td>\n<\/tr>\n
135<\/td>\n12.3 Visual rejection criteria <\/td>\n<\/tr>\n
137<\/td>\n12.4 X-ray rejection criteria <\/td>\n<\/tr>\n
138<\/td>\n12.5 Warp and twist of populated boards
12.6 Inspection records <\/td>\n<\/tr>\n
139<\/td>\n13 Verification procedure
13.1 Verification approval procedure
13.1.1 Request for verification
13.1.2 Technology sample
13.1.2.1 Description of technology sample
13.1.2.2 Evaluation of technology sample <\/td>\n<\/tr>\n
140<\/td>\n13.1.3 Audit of assembly processing
13.1.4 Verification programme documentation <\/td>\n<\/tr>\n
141<\/td>\n13.1.5 Verification samples and testing <\/td>\n<\/tr>\n
142<\/td>\n13.1.6 Final verification review
13.1.7 Approval status of assembly line <\/td>\n<\/tr>\n
143<\/td>\n13.1.8 Withdrawal of approval status
13.2 Verification programme
13.2.1 General <\/td>\n<\/tr>\n
149<\/td>\n13.2.2 Verification for PTH manual soldering
13.2.3 Additional verification for wave soldering
13.2.4 Soldering log <\/td>\n<\/tr>\n
151<\/td>\n13.3 Special verification testing for ceramic area array components
13.3.1 General <\/td>\n<\/tr>\n
153<\/td>\n13.3.2 Evaluation of AAD capability samples
13.3.3 Electrical verification of AAD assembly <\/td>\n<\/tr>\n
154<\/td>\n13.4 Assembly verification with electrical testing procedure <\/td>\n<\/tr>\n
157<\/td>\n13.5 Verification programme with reduced temperature range <\/td>\n<\/tr>\n
158<\/td>\n13.6 Verification for solderless process <\/td>\n<\/tr>\n
160<\/td>\n13.7 Conditions for delta verification <\/td>\n<\/tr>\n
162<\/td>\n13.8 Verification by similarity
13.8.1 General conditions for similarity
13.8.2 Conditions for similarity for PTH components <\/td>\n<\/tr>\n
163<\/td>\n13.8.3 Conditions for similarity for SMD <\/td>\n<\/tr>\n
166<\/td>\n13.8.4 Conditions for similarity for solderless components <\/td>\n<\/tr>\n
167<\/td>\n14 Environmental tests conditions
14.1 Overview
14.2 Visual inspection
14.3 X-ray inspection
14.4 Cleanliness test
14.5 Warp and twist of PCB <\/td>\n<\/tr>\n
168<\/td>\n14.6 Electrical continuity measurement
14.7 Electrical continuity for wave soldered multilayers PCB <\/td>\n<\/tr>\n
169<\/td>\n14.8 Vibration <\/td>\n<\/tr>\n
171<\/td>\n14.9 Mechanical shock <\/td>\n<\/tr>\n
173<\/td>\n14.10 Damp heat test
14.11 Temperature cycling test <\/td>\n<\/tr>\n
174<\/td>\n14.12 Temperature cycling test with reduced temperature range <\/td>\n<\/tr>\n
176<\/td>\n14.13 Life test
14.14 Final visual inspection <\/td>\n<\/tr>\n
177<\/td>\n14.15 Microsection
14.15.1 Microsection facilities
14.15.2 Microsections location <\/td>\n<\/tr>\n
178<\/td>\n14.15.3 Microsection acceptance criteria
14.15.3.1 General
14.15.3.2 Acceptance criteria <\/td>\n<\/tr>\n
191<\/td>\n14.15.4 Microsection acceptance criteria for ceramic chip capacitors <\/td>\n<\/tr>\n
198<\/td>\n14.16 Anomalies in PCB and sculptured flex during verification <\/td>\n<\/tr>\n
199<\/td>\n15 Outsourcing
15.1 General <\/td>\n<\/tr>\n
201<\/td>\n16 Process identification document (PID)
16.1 Overview
16.2 Document preparation
16.3 Approval
16.4 Contact person
16.5 Process identification document update <\/td>\n<\/tr>\n
202<\/td>\n17 Quality assurance
17.1 General
17.2 Data
17.3 Nonconformance
17.4 Calibration <\/td>\n<\/tr>\n
203<\/td>\n17.5 Traceability
17.6 Workmanship standards
17.7 Inspection points
17.8 Operators, inspectors and instructors training and certification <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Space product assurance. High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2022<\/td>\n256<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":418444,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[432,2641],"product_tag":[],"class_list":{"0":"post-418435","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-25-160-50","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/418435","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/418444"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=418435"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=418435"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=418435"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}