{"id":422337,"date":"2024-10-20T06:40:45","date_gmt":"2024-10-20T06:40:45","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-62878-2-72019-2\/"},"modified":"2024-10-26T12:30:22","modified_gmt":"2024-10-26T12:30:22","slug":"bsi-pd-iec-tr-62878-2-72019-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-62878-2-72019-2\/","title":{"rendered":"BSI PD IEC TR 62878-2-7:2019"},"content":{"rendered":"

This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
5<\/td>\nFOREWORD <\/td>\n<\/tr>\n
7<\/td>\n1 Scope
2 Normative references
3 Terms and definitions
4 Overview of accelerated stress testing of passive embedded circuit boards
4.1 Testing under combined stresses <\/td>\n<\/tr>\n
8<\/td>\n4.2 Test coupon design
Figures
Figure 1 \u2013 Testing principal
Figure 2 \u2013 Embedded circuit board panel with test coupons <\/td>\n<\/tr>\n
9<\/td>\nFigure 3 \u2013 Test coupon structure
Tables
Table 1 \u2013 Design information for test coupon
Table 2 \u2013 Stack-up information for test coupon <\/td>\n<\/tr>\n
10<\/td>\n5 Test procedure
5.1 General
5.2 Setting test temperature
5.3 Placement of samples on bending tester
Figure 4 \u2013 Opened and closed sample jig <\/td>\n<\/tr>\n
11<\/td>\n5.4 Imposing combined stresses
5.5 Evaluation of results
Figure 5 \u2013 Bending of test coupons <\/td>\n<\/tr>\n
12<\/td>\n6 Results
Figure 6 \u2013 Output voltage
Figure 7 \u2013 Cross section of sample after testing
Figure 8 \u2013 Cross section of failed sample
Table 3 \u2013 Coupon testing results <\/td>\n<\/tr>\n
13<\/td>\nAnnex A (informative)Test coupon design rule
Table A.1 \u2013 Test coupon design rules <\/td>\n<\/tr>\n
14<\/td>\nAnnex B (informative)Bending testing
Figure B.1 \u2013 Bending tester in the chamber <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Device embedding assembly technology – Guidelines. Accelerated stress testing of passive embedded circuit boards<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n16<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":422347,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-422337","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/422337","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/422347"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=422337"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=422337"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=422337"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}