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BS 123400-003:2001

BS 123400-003:2001

$167.15

System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections

Published By Publication Date Number of Pages
BSI 2001 34
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This British Standard specifies the capability qualifying component, its characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing basic and additional capability, in relation to flexible single-sided and double-sided printed boards without through-connections. It is applicable for flexible single-sided and double-sided printed boards without through-connections made with the materials and surface finishes specified in clause 4.

This British Standard is a capability detail specification intended for use with the IECQ system of quality assessment for electronic components.

PDF Catalog

PDF Pages PDF Title
1 BRITISH STANDARD
2 Committees responsible for this British�Standard
3 Contents
7 1 Scope
2 Normative references
8 3 Terms and definitions
3.1 referee method
4 Capability qualifying component
4.1 General
4.2 Base materials
9 Table 1 Base materials
4.3 Surface finishes
10 Table 2 Metallic finishes
Table 3 Organic finishes
11 5 Range of capability approval
6 Capability test programme
6.1 General
6.2 Other metallic surface finishes
6.3 Organic surface finishes
6.4 Bonded stiffeners and rigidizers
12 7 Additional capability
7.1 Maximum active board size
7.2 Minimum conductor width and spacing
7.3 Metallic conductor finishes
8 Traceability
13 Table 4 Capability approval test schedule and performance requirements — General
17 Table 5 Capability approval test schedule and performance requirements — Additional metallic conductor fi…
20 Table 6 Capability approval test schedule and performance requirements — Additional contact finishes
21 Table 7 Capability approval test schedule and performance requirements — Permanent organic finishes
23 Table 8 Capability approval test schedule and performance requirements — Bonded stiffeners and rigidizers
25 Annex A (normative) Test pattern for marking inks
Figure A.1 Test pattern for marking inks
26 Annex B (normative) Test pattern for solder masks
Figure B.1 Test pattern for solder mask or coverlayer
27 Annex C (normative) Assembly of test pattern for rigidizers or stiffeners
Figure C.1 Assembly of test pattern for rigidizers or stiffeners
28 Figure C.2 Component parts of test pattern for rigidizers or stiffeners
29 Annex D (normative) Use of ANSI/IPC A-600F
Table D.1 Capability approval test schedule — General and additional metallic conductor finishes
30 Table D.2 Capability approval test schedule — Printed contacts
31 Table D.3 Capability approval test schedule — Solder resist
Table D.4 Capability approval test schedule — Flexible/flex-rigid printed boards
Annex E (normative) Test method for solder resistance of organic coatings

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BS 123400-003:2001
$167.15